1. Crystallography and Product Principles of Silicon Carbide
1.1 Polymorphism and Atomic Bonding in SiC
(Silicon Carbide Ceramic Plates)
Silicon carbide (SiC) is a covalent ceramic compound made up of silicon and carbon atoms in a 1:1 stoichiometric ratio, identified by its impressive polymorphism– over 250 well-known polytypes– all sharing solid directional covalent bonds yet differing in stacking series of Si-C bilayers.
One of the most highly pertinent polytypes are 3C-SiC (cubic zinc blende framework), and the hexagonal kinds 4H-SiC and 6H-SiC, each displaying subtle variations in bandgap, electron mobility, and thermal conductivity that influence their suitability for details applications.
The toughness of the Si– C bond, with a bond power of about 318 kJ/mol, underpins SiC’s remarkable solidity (Mohs hardness of 9– 9.5), high melting factor (~ 2700 ° C), and resistance to chemical deterioration and thermal shock.
In ceramic plates, the polytype is usually chosen based upon the meant usage: 6H-SiC prevails in structural applications because of its convenience of synthesis, while 4H-SiC controls in high-power electronics for its remarkable fee carrier movement.
The large bandgap (2.9– 3.3 eV depending on polytype) also makes SiC an exceptional electrical insulator in its pure form, though it can be doped to operate as a semiconductor in specialized electronic devices.
1.2 Microstructure and Stage Purity in Ceramic Plates
The efficiency of silicon carbide ceramic plates is critically dependent on microstructural attributes such as grain size, thickness, phase homogeneity, and the presence of secondary phases or pollutants.
Premium plates are commonly produced from submicron or nanoscale SiC powders through sophisticated sintering methods, resulting in fine-grained, completely thick microstructures that make best use of mechanical stamina and thermal conductivity.
Pollutants such as free carbon, silica (SiO TWO), or sintering help like boron or light weight aluminum need to be carefully managed, as they can form intergranular films that minimize high-temperature stamina and oxidation resistance.
Recurring porosity, also at reduced levels (
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